Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecNumar contacte
100
Product Type
PCB Socket
Number of Rows
2
Sub Type
Board-to-Board
Pitch
0.8mm
Current
1.4A
Terminal
Solder
Housing Material
Liquid Crystal Polymer
Montare
Surface
Pozitionare
Straight
Stacking Height
18mm
Connector System
Board-to-Board
Tensiune
200 V
Serie
ERF8
Temperatura minima de lucru
-55°C
Row Pitch
4.5mm
Temperatura maxima de lucru
125°C
Material de contact
Beryllium Copper Alloy
Placa contact
Gold
Standards/Approvals
No
Detalii produs
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.
0.8mm Board to Board - Samtec
Informatii despre stoc temporar indisponibile
P.O.A.
Standard
1
P.O.A.
Informatii despre stoc temporar indisponibile
Standard
1
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecNumar contacte
100
Product Type
PCB Socket
Number of Rows
2
Sub Type
Board-to-Board
Pitch
0.8mm
Current
1.4A
Terminal
Solder
Housing Material
Liquid Crystal Polymer
Montare
Surface
Pozitionare
Straight
Stacking Height
18mm
Connector System
Board-to-Board
Tensiune
200 V
Serie
ERF8
Temperatura minima de lucru
-55°C
Row Pitch
4.5mm
Temperatura maxima de lucru
125°C
Material de contact
Beryllium Copper Alloy
Placa contact
Gold
Standards/Approvals
No
Detalii produs
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.


