Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecNumar contacte
40
Number Of Rows
2
Pitch
2mm
Tip produs
Board to Board
Montare
Through Hole
Body Orientation
Straight
Terminal
Solder
Curent nominal
3.3A
Serie
CLT
Material de contact
Bronze
Detalii produs
CLT Series Low Profile Dual Wipe Socket
These CLT Series Board to Board, Low Profile, Dual Wipe Sockets from Samtec have 0.25 μm Gold plating on the Tiger Claw contacts and Matte Tin on the PCB Tails. This range of CLT Series Board-to-Board, Low Profile, Dual Wipe Sockets includes both Through Hole and SMT versions. The Through Hole versions of these CLT Series Board to Board, Low Profile, Dual Wipe Sockets have 2.16 mm long PCB Tails and an above board height of 2.121 mm. The SMT versions of these CLT Series Board-to-Board, Low Profile, Dual Wipe Sockets have an above board height of 2.27 mm.
P.O.A.
Impachetare pentru productie (Tub)
1
P.O.A.
Informatii despre stoc temporar indisponibile
Impachetare pentru productie (Tub)
1
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecNumar contacte
40
Number Of Rows
2
Pitch
2mm
Tip produs
Board to Board
Montare
Through Hole
Body Orientation
Straight
Terminal
Solder
Curent nominal
3.3A
Serie
CLT
Material de contact
Bronze
Detalii produs
CLT Series Low Profile Dual Wipe Socket
These CLT Series Board to Board, Low Profile, Dual Wipe Sockets from Samtec have 0.25 μm Gold plating on the Tiger Claw contacts and Matte Tin on the PCB Tails. This range of CLT Series Board-to-Board, Low Profile, Dual Wipe Sockets includes both Through Hole and SMT versions. The Through Hole versions of these CLT Series Board to Board, Low Profile, Dual Wipe Sockets have 2.16 mm long PCB Tails and an above board height of 2.121 mm. The SMT versions of these CLT Series Board-to-Board, Low Profile, Dual Wipe Sockets have an above board height of 2.27 mm.


