RS PRO Paste 310 ml

Nr. stoc RS: 494-102Producator: RS PRO
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Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

RS Pro

Application

Copper, Semiconductor

Package Size

310 ml

Food Processing Safe

No

Cure Time

7 Days

Forma produs

Paste

Tara de origine

Belgium

Detalii produs

Non-Corrosive Silicone Sealant

One-component, room temperature curing silicone elastomer. Cross linking takes place in the presence of moisture in the air to form a flexible resilient silicone rubber. The material does not evolve any corrosive volatiles, e.g. acetic acid, amines, during cure and is therefore suitable for use on copper, its alloys and other sensitive metals. This property also results in a very low odour emission compared to acetoxy grades. The thixotropic paste has excellent adhesion to most materials (except PTFE and polyethylene) and can withstand temperatures of -40°C to +150°C whilst still maintaining chemical resistance. Typical uses are protection of semiconductor junctions, finishing protection of assemblies and delicate devices, sealing to copper clad items.

Informatii despre stoc temporar indisponibile

€ 31,83

€ 31,83 Buc. (fara TVA)

€ 38,51

€ 38,51 Buc. (cu TVA)

RS PRO Paste 310 ml

€ 31,83

€ 31,83 Buc. (fara TVA)

€ 38,51

€ 38,51 Buc. (cu TVA)

RS PRO Paste 310 ml

Informatii despre stoc temporar indisponibile

CantitatePret unitar
1 - 5€ 31,83
6 - 14€ 30,35
15+€ 29,45

Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

RS Pro

Application

Copper, Semiconductor

Package Size

310 ml

Food Processing Safe

No

Cure Time

7 Days

Forma produs

Paste

Tara de origine

Belgium

Detalii produs

Non-Corrosive Silicone Sealant

One-component, room temperature curing silicone elastomer. Cross linking takes place in the presence of moisture in the air to form a flexible resilient silicone rubber. The material does not evolve any corrosive volatiles, e.g. acetic acid, amines, during cure and is therefore suitable for use on copper, its alloys and other sensitive metals. This property also results in a very low odour emission compared to acetoxy grades. The thixotropic paste has excellent adhesion to most materials (except PTFE and polyethylene) and can withstand temperatures of -40°C to +150°C whilst still maintaining chemical resistance. Typical uses are protection of semiconductor junctions, finishing protection of assemblies and delicate devices, sealing to copper clad items.