RS PRO Heatsink, Universal Rectangular Alu, 1.9°C/W 25 mm 75 mm 88 mm

Nr. stoc RS: 789-8558Producator: RS PRONr. articol Distrelec: 30403512
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Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

RS Pro

Product Type

Heatsink

Utilizare cu

Universal Rectangular Alu

Lungime

75mm

Latime

88 mm

Inaltime

25mm

Thermal Resistance

1.9°C/W

Culoare

Black

Finisare

Black Anodised

Standards/Approvals

RoHS

Material

Aluminium

Tara de origine

United Kingdom

Detalii produs

Low Profile Non-standard Extrusion With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Informatii despre stoc temporar indisponibile

€ 10,88

€ 10,88 Buc. (fara TVA)

€ 13,16

€ 13,16 Buc. (cu TVA)

RS PRO Heatsink, Universal Rectangular Alu, 1.9°C/W 25 mm 75 mm 88 mm

€ 10,88

€ 10,88 Buc. (fara TVA)

€ 13,16

€ 13,16 Buc. (cu TVA)

RS PRO Heatsink, Universal Rectangular Alu, 1.9°C/W 25 mm 75 mm 88 mm

Informatii despre stoc temporar indisponibile

CantitatePret unitar
1 - 9€ 10,88
10 - 24€ 9,97
25 - 49€ 9,45
50+€ 9,08

Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

RS Pro

Product Type

Heatsink

Utilizare cu

Universal Rectangular Alu

Lungime

75mm

Latime

88 mm

Inaltime

25mm

Thermal Resistance

1.9°C/W

Culoare

Black

Finisare

Black Anodised

Standards/Approvals

RoHS

Material

Aluminium

Tara de origine

United Kingdom

Detalii produs

Low Profile Non-standard Extrusion With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.