RS PRO Heatsink, Universal Rectangular Alu, 1.4kΩ/W 35 mm 100 mm 88 mm

Nr. stoc RS: 234-2542Producator: RS PRO
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Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

RS Pro

Product Type

Heatsink

Utilizare cu

Universal Rectangular Alu

Lungime

100mm

Latime

88 mm

Inaltime

35mm

Fastening

Screw

Thermal Resistance

1.4kΩ/W

Culoare

Black

Finisare

Black Anodised

Standards/Approvals

RoHS

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Tara de origine

United Kingdom

Detalii produs

Non Standard Extrusion 88mm Wide x 35mm High With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Informatii despre stoc temporar indisponibile

€ 17,42

€ 17,42 Buc. (fara TVA)

€ 21,08

€ 21,08 Buc. (cu TVA)

RS PRO Heatsink, Universal Rectangular Alu, 1.4kΩ/W 35 mm 100 mm 88 mm

€ 17,42

€ 17,42 Buc. (fara TVA)

€ 21,08

€ 21,08 Buc. (cu TVA)

RS PRO Heatsink, Universal Rectangular Alu, 1.4kΩ/W 35 mm 100 mm 88 mm

Informatii despre stoc temporar indisponibile

CantitatePret unitar
1 - 9€ 17,42
10 - 24€ 15,95
25 - 49€ 15,22
50+€ 14,66

Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

RS Pro

Product Type

Heatsink

Utilizare cu

Universal Rectangular Alu

Lungime

100mm

Latime

88 mm

Inaltime

35mm

Fastening

Screw

Thermal Resistance

1.4kΩ/W

Culoare

Black

Finisare

Black Anodised

Standards/Approvals

RoHS

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Tara de origine

United Kingdom

Detalii produs

Non Standard Extrusion 88mm Wide x 35mm High With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.