RS PRO Heatsink, Universal Rectangular Alu, 0.31°C/W, 200 x 150 x 25mm, PCB Mount

Nr. stoc RS: 903-3157Producator: RS PRO
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Documente tehnice

Specificatii

Marca

RS Pro

Utilizare cu

Universal Rectangular Alu

Lungime

200mm

Latime

150mm

Inaltime

25mm

Dimensiuni

200 x 150 x 25mm

Thermal Resistance

0.31°C/W

Montare

PCB Mount

Serie

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finisare

Anodized

Tara de origine

United Kingdom

Detalii produs

Heat Sink 113AB Series, 150mm Wide x 25mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 46,22

Buc. (fara TVA)

€ 55,00

Buc. (cu TVA)

RS PRO Heatsink, Universal Rectangular Alu, 0.31°C/W, 200 x 150 x 25mm, PCB Mount

€ 46,22

Buc. (fara TVA)

€ 55,00

Buc. (cu TVA)

RS PRO Heatsink, Universal Rectangular Alu, 0.31°C/W, 200 x 150 x 25mm, PCB Mount
Informatii indisponibile despre stoc

Cumpara in pachete mari

CantitatePret unitar
1 - 9€ 46,22
10 - 24€ 40,93
25 - 49€ 38,79
50+€ 37,07

Documente tehnice

Specificatii

Marca

RS Pro

Utilizare cu

Universal Rectangular Alu

Lungime

200mm

Latime

150mm

Inaltime

25mm

Dimensiuni

200 x 150 x 25mm

Thermal Resistance

0.31°C/W

Montare

PCB Mount

Serie

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finisare

Anodized

Tara de origine

United Kingdom

Detalii produs

Heat Sink 113AB Series, 150mm Wide x 25mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.