Documente tehnice
Specificatii
Marca
OhmiteUtilizare cu
TBH25, TCH35, TEH100, TEH70
Lungime
41.6mm
Latime
25mm
Inaltime
63.5mm
Dimensiuni
41.6 x 25 x 63.5mm
Thermal Resistance
3°C/W
Montare
Vertical
Serie
F
Culoare
Black
Tip pachet
TO-218, TO-220, TO-247
Material
Aluminium
Surface Area
22814mm²
Caracteristici speciale
With Solderable Pin
Finisare
Black Anodized
Tara de origine
China
Detalii produs
Ohmite F/R Series Vertical Mount Heatsinks
Ohmite F/R Series heatsink provides a large surface area with spring clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are required for device mounting, additional fins can be added to the rear side of the heatsink for increased total surface area in a more compact space.
€ 30,70
€ 3,07 Buc. (Intr-un pachet de 10) (fara TVA)
€ 36,53
€ 3,653 Buc. (Intr-un pachet de 10) (cu TVA)
10
€ 30,70
€ 3,07 Buc. (Intr-un pachet de 10) (fara TVA)
€ 36,53
€ 3,653 Buc. (Intr-un pachet de 10) (cu TVA)
10
Informatii despre stoc temporar indisponibile
Incercati din nou mai tarziu
Cantitate | Pret unitar | Per Pachet |
---|---|---|
10 - 90 | € 3,07 | € 30,70 |
100 - 240 | € 2,80 | € 28,00 |
250 - 490 | € 2,65 | € 26,50 |
500 - 990 | € 2,54 | € 25,40 |
1000+ | € 2,30 | € 23,00 |
Documente tehnice
Specificatii
Marca
OhmiteUtilizare cu
TBH25, TCH35, TEH100, TEH70
Lungime
41.6mm
Latime
25mm
Inaltime
63.5mm
Dimensiuni
41.6 x 25 x 63.5mm
Thermal Resistance
3°C/W
Montare
Vertical
Serie
F
Culoare
Black
Tip pachet
TO-218, TO-220, TO-247
Material
Aluminium
Surface Area
22814mm²
Caracteristici speciale
With Solderable Pin
Finisare
Black Anodized
Tara de origine
China
Detalii produs
Ohmite F/R Series Vertical Mount Heatsinks
Ohmite F/R Series heatsink provides a large surface area with spring clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are required for device mounting, additional fins can be added to the rear side of the heatsink for increased total surface area in a more compact space.