Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MurataCapacitate
1µF
Tensiune
25V dc
Package/Case
0805 (2012M)
Timp montare
Surface Mount
Dielectric
X5R
Toleranta
±10%
Inaltime
1.8mm
Serie
GRM
Temperatura maxima de lucru
+85°C
Temperatura minima de lucru
-55°C
Tip terminal
Surface Mount
Detalii produs
Murata GRM 0805 X5R, X7R and Y5V Dielectric
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
P.O.A.
Buc. (Intr-un pachet de 50) (fara TVA)
50
P.O.A.
Buc. (Intr-un pachet de 50) (fara TVA)
Informatii despre stoc temporar indisponibile
50
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MurataCapacitate
1µF
Tensiune
25V dc
Package/Case
0805 (2012M)
Timp montare
Surface Mount
Dielectric
X5R
Toleranta
±10%
Inaltime
1.8mm
Serie
GRM
Temperatura maxima de lucru
+85°C
Temperatura minima de lucru
-55°C
Tip terminal
Surface Mount
Detalii produs
Murata GRM 0805 X5R, X7R and Y5V Dielectric
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
