Documente tehnice
Specificatii
Marca
MolexCard Type
Chip SIM
Subtip
Female
Insertion/Removal Method
Push/Push
Numar contacte
6
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel, Tin
Terminal
Solder
Housing Material
Thermoplastic
Lungime
26.0mm
Latime
22.8mm
Adancime
3.0mm
Dimensiuni
26 x 22.8 x 3mm
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+85°C
Dimensiune celula
91228
Tara de origine
Ireland
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 8,72
Buc. (Pe o rola de 400) (fara TVA)
€ 10,377
Buc. (Pe o rola de 400) (cu TVA)
400
€ 8,72
Buc. (Pe o rola de 400) (fara TVA)
€ 10,377
Buc. (Pe o rola de 400) (cu TVA)
400
Cumpara in pachete mari
Cantitate | Pret unitar | Per Rola |
---|---|---|
400 - 1600 | € 8,72 | € 3.488,00 |
2000 - 3600 | € 8,19 | € 3.276,00 |
4000 - 7600 | € 7,91 | € 3.164,00 |
8000+ | € 7,65 | € 3.060,00 |
Documente tehnice
Specificatii
Marca
MolexCard Type
Chip SIM
Subtip
Female
Insertion/Removal Method
Push/Push
Numar contacte
6
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel, Tin
Terminal
Solder
Housing Material
Thermoplastic
Lungime
26.0mm
Latime
22.8mm
Adancime
3.0mm
Dimensiuni
26 x 22.8 x 3mm
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+85°C
Dimensiune celula
91228
Tara de origine
Ireland