Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
DIMM Socket
Memory Socket Type
MiniDIMM
Insertion/Removal Method
Latched
Pozitionare
Vertical
Current
1A
Material de contact
Copper Alloy
Placa contact
Gold, Gold
Numar contacte
244
Pitch
0.6mm
Montare
Surface, Surface Mount
Housing Material
High Temperature Thermoplastic
SDRAM Type
DDR3
Temperatura minima de lucru
-55°C
Terminal
Surface Mount
Blocare
Yes
Temperatura maxima de lucru
85°C
Standards/Approvals
CSA LR19980, UL E29179
Series
87782
Tara de origine
Singapore
Informatii despre stoc temporar indisponibile
P.O.A.
Each (In a Tray of 45) (fara TVA)
45
P.O.A.
Each (In a Tray of 45) (fara TVA)
Informatii despre stoc temporar indisponibile
45
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
DIMM Socket
Memory Socket Type
MiniDIMM
Insertion/Removal Method
Latched
Pozitionare
Vertical
Current
1A
Material de contact
Copper Alloy
Placa contact
Gold, Gold
Numar contacte
244
Pitch
0.6mm
Montare
Surface, Surface Mount
Housing Material
High Temperature Thermoplastic
SDRAM Type
DDR3
Temperatura minima de lucru
-55°C
Terminal
Surface Mount
Blocare
Yes
Temperatura maxima de lucru
85°C
Standards/Approvals
CSA LR19980, UL E29179
Series
87782
Tara de origine
Singapore
