Documente tehnice
Specificatii
Marca
MolexCard Type
Mini SIM Card
Insertion/Removal Method
Push/Pull
Subtip
Female
Numar contacte
8
Number Of Rows
1
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel
Terminal
Solder
Housing Material
Steel, Thermoplastic
Lungime
21.0mm
Latime
1.5mm
Adancime
28.0mm
Dimensiuni
21 x 1.5 x 28mm
Frecventa minima de auto-rezonanta
-20°C
Temperatura maxima de lucru
+85°C
Dimensiune celula
78526
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Documente tehnice
Specificatii
Marca
MolexCard Type
Mini SIM Card
Insertion/Removal Method
Push/Pull
Subtip
Female
Numar contacte
8
Number Of Rows
1
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel
Terminal
Solder
Housing Material
Steel, Thermoplastic
Lungime
21.0mm
Latime
1.5mm
Adancime
28.0mm
Dimensiuni
21 x 1.5 x 28mm
Frecventa minima de auto-rezonanta
-20°C
Temperatura maxima de lucru
+85°C
Dimensiune celula
78526