Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
MICROCLASP
Pitch
2.0mm
Numar contacte
18
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Curent nominal
3.0A
Dimensiune celula
55959
Tensiune
250.0 V
Tara de origine
Japan
Detalii produs
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
€ 8,40
€ 0,84 Buc. (Intr-un pachet de 10) (fara TVA)
€ 10,16
€ 1,016 Buc. (Intr-un pachet de 10) (cu TVA)
Standard
10
€ 8,40
€ 0,84 Buc. (Intr-un pachet de 10) (fara TVA)
€ 10,16
€ 1,016 Buc. (Intr-un pachet de 10) (cu TVA)
Informatii despre stoc temporar indisponibile
Standard
10
Informatii despre stoc temporar indisponibile
Cantitate | Pret unitar | Per Pachet |
---|---|---|
10 - 190 | € 0,84 | € 8,40 |
200 - 740 | € 0,73 | € 7,30 |
750 - 2990 | € 0,65 | € 6,50 |
3000+ | € 0,62 | € 6,20 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
MICROCLASP
Pitch
2.0mm
Numar contacte
18
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Curent nominal
3.0A
Dimensiune celula
55959
Tensiune
250.0 V
Tara de origine
Japan
Detalii produs
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.