Documente tehnice
Specificatii
Marca
MolexSerie
MICROCLASP
Pitch
2.0mm
Numar contacte
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Curent nominal
3.0A
Dimensiune celula
55932
Tensiune nominala
250.0 V
Tara de origine
Japan
Detalii produs
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
€ 3,20
€ 0,32 Buc. (Intr-un pachet de 10) (fara TVA)
€ 3,81
€ 0,381 Buc. (Intr-un pachet de 10) (cu TVA)
Standard
10
€ 3,20
€ 0,32 Buc. (Intr-un pachet de 10) (fara TVA)
€ 3,81
€ 0,381 Buc. (Intr-un pachet de 10) (cu TVA)
Standard
10
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
Cantitate | Pret unitar | Per Pachet |
---|---|---|
10 - 240 | € 0,32 | € 3,20 |
250 - 990 | € 0,23 | € 2,30 |
1000 - 4990 | € 0,18 | € 1,80 |
5000 - 9990 | € 0,17 | € 1,70 |
10000+ | € 0,17 | € 1,70 |
Documente tehnice
Specificatii
Marca
MolexSerie
MICROCLASP
Pitch
2.0mm
Numar contacte
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Curent nominal
3.0A
Dimensiune celula
55932
Tensiune nominala
250.0 V
Tara de origine
Japan
Detalii produs
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.