Documente tehnice
Specificatii
Marca
MolexCard Type
SIM
Subtip
Male
Insertion/Removal Method
Push/Push
Numar contacte
8
Number Of Rows
1
Pitch
1.27mm
Body Orientation
Right Angle
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel
Terminal
Solder
Housing Material
Thermoplastic
Lungime
26.3mm
Latime
19.35mm
Adancime
1.9mm
Dimensiune celula
47603
Dimensiuni
26.3 x 19.35 x 1.9mm
Frecventa minima de auto-rezonanta
-20°C
Temperatura maxima de lucru
+70°C
Tara de origine
China
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 5,12
Buc. (Intr-un pachet de 5) (fara TVA)
€ 6,093
Buc. (Intr-un pachet de 5) (cu TVA)
Standard
5
€ 5,12
Buc. (Intr-un pachet de 5) (fara TVA)
€ 6,093
Buc. (Intr-un pachet de 5) (cu TVA)
Standard
5
Cumpara in pachete mari
Cantitate | Pret unitar | Per Pachet |
---|---|---|
5 - 20 | € 5,12 | € 25,60 |
25 - 45 | € 4,72 | € 23,60 |
50 - 120 | € 4,37 | € 21,85 |
125 - 495 | € 4,07 | € 20,35 |
500+ | € 3,81 | € 19,05 |
Documente tehnice
Specificatii
Marca
MolexCard Type
SIM
Subtip
Male
Insertion/Removal Method
Push/Push
Numar contacte
8
Number Of Rows
1
Pitch
1.27mm
Body Orientation
Right Angle
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel
Terminal
Solder
Housing Material
Thermoplastic
Lungime
26.3mm
Latime
19.35mm
Adancime
1.9mm
Dimensiune celula
47603
Dimensiuni
26.3 x 19.35 x 1.9mm
Frecventa minima de auto-rezonanta
-20°C
Temperatura maxima de lucru
+70°C
Tara de origine
China