Documente tehnice
Specificatii
Marca
MolexCard Type
SIM
Subtip
Female
Numar contacte
6
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold, Gold over Nickel
Terminal
Solder
Housing Material
Thermoplastic
Adancime
2.4mm
Frecventa minima de auto-rezonanta
-30°C
Temperatura maxima de lucru
+85°C
Dimensiune celula
47019
Tara de origine
China
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P.O.A.
7500
P.O.A.
7500
Documente tehnice
Specificatii
Marca
MolexCard Type
SIM
Subtip
Female
Numar contacte
6
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold, Gold over Nickel
Terminal
Solder
Housing Material
Thermoplastic
Adancime
2.4mm
Frecventa minima de auto-rezonanta
-30°C
Temperatura maxima de lucru
+85°C
Dimensiune celula
47019
Tara de origine
China