Documente tehnice
Specificatii
Marca
MolexSerie
MICRO-FIT 3.0
Pitch
3.0mm
Numar contacte
4
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Montare
Surface Mount
Connector System
Wire to Board
Terminal
Solder
Material de contact
Brass
Placa contact
Tin
Curent nominal
5.0A
Dimensiune celula
43650
Tensiune nominala
250.0 V
Detalii produs
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
€ 5,70
€ 1,14 Each (Supplied as a Tape) (fara TVA)
€ 6,78
€ 1,357 Each (Supplied as a Tape) (cu TVA)
Impachetare pentru productie (Banda)
5
€ 5,70
€ 1,14 Each (Supplied as a Tape) (fara TVA)
€ 6,78
€ 1,357 Each (Supplied as a Tape) (cu TVA)
Impachetare pentru productie (Banda)
5
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Documente tehnice
Specificatii
Marca
MolexSerie
MICRO-FIT 3.0
Pitch
3.0mm
Numar contacte
4
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Montare
Surface Mount
Connector System
Wire to Board
Terminal
Solder
Material de contact
Brass
Placa contact
Tin
Curent nominal
5.0A
Dimensiune celula
43650
Tensiune nominala
250.0 V
Detalii produs
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.