Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Numar contacte
3
Housing Material
High Temperature Thermoplastic
Number of Rows
1
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Surface
Material de contact
Brass
Placa contact
Gold
Frecventa minima de auto-rezonanta
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
250 V
Distrelec Product Id
304-62-230
Detalii produs
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
€ 202,00
€ 2,02 Buc. (Livrat pe rola) (fara TVA)
€ 244,42
€ 2,444 Buc. (Livrat pe rola) (cu TVA)
Impachetare pentru productie (Rola)
100
€ 202,00
€ 2,02 Buc. (Livrat pe rola) (fara TVA)
€ 244,42
€ 2,444 Buc. (Livrat pe rola) (cu TVA)
Informatii despre stoc temporar indisponibile
Impachetare pentru productie (Rola)
100
Informatii despre stoc temporar indisponibile
| Cantitate | Pret unitar | Per Rola |
|---|---|---|
| 100 - 370 | € 2,02 | € 10,10 |
| 375 - 1495 | € 1,83 | € 9,15 |
| 1500 - 2995 | € 1,58 | € 7,90 |
| 3000+ | € 1,50 | € 7,50 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Numar contacte
3
Housing Material
High Temperature Thermoplastic
Number of Rows
1
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Surface
Material de contact
Brass
Placa contact
Gold
Frecventa minima de auto-rezonanta
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
250 V
Distrelec Product Id
304-62-230
Detalii produs
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.


