Documente tehnice
Specificatii
Marca
MolexSerie
MICRO-FIT 3.0
Pitch
3.0mm
Numar contacte
2
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Surface Mount
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Dimensiune celula
43650
Curent nominal
5.0A
Tensiune
250.0 V
Tara de origine
Mexico
Detalii produs
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 1,04
Buc. (Intr-un pachet de 5) (fara TVA)
€ 1,238
Buc. (Intr-un pachet de 5) (cu TVA)
Standard
5
€ 1,04
Buc. (Intr-un pachet de 5) (fara TVA)
€ 1,238
Buc. (Intr-un pachet de 5) (cu TVA)
Standard
5
Documente tehnice
Specificatii
Marca
MolexSerie
MICRO-FIT 3.0
Pitch
3.0mm
Numar contacte
2
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Surface Mount
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Dimensiune celula
43650
Curent nominal
5.0A
Tensiune
250.0 V
Tara de origine
Mexico
Detalii produs
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.