Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Numar contacte
2
Housing Material
Thermoplastic
Number of Rows
1
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Through Hole
Material de contact
Brass
Placa contact
Tin
Temperatura minima de lucru
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
105°C
Standards/Approvals
No
Tensiune
250 V
Distrelec Product Id
304-42-700
Detalii produs
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
Molex Micro-Fit 3.0 Series
Informatii despre stoc temporar indisponibile
€ 96,00
€ 0,96 Each (Supplied in a Bag) (fara TVA)
€ 116,16
€ 1,162 Each (Supplied in a Bag) (cu TVA)
Impachetare pentru productie (Punga)
100
€ 96,00
€ 0,96 Each (Supplied in a Bag) (fara TVA)
€ 116,16
€ 1,162 Each (Supplied in a Bag) (cu TVA)
Informatii despre stoc temporar indisponibile
Impachetare pentru productie (Punga)
100
| Cantitate | Pret unitar | Per Punga |
|---|---|---|
| 100 - 370 | € 0,96 | € 4,80 |
| 375 - 1495 | € 0,91 | € 4,55 |
| 1500 - 2995 | € 0,83 | € 4,15 |
| 3000+ | € 0,79 | € 3,95 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Numar contacte
2
Housing Material
Thermoplastic
Number of Rows
1
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Through Hole
Material de contact
Brass
Placa contact
Tin
Temperatura minima de lucru
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
105°C
Standards/Approvals
No
Tensiune
250 V
Distrelec Product Id
304-42-700
Detalii produs
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs


