Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
MICRO-FIT 3.0
Pitch
3.0mm
Numar contacte
18
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Surface Mount
Terminal
Solder
Material de contact
Brass
Placa contact
Tin
Curent nominal
5.0A
Dimensiune celula
43045
Tensiune
250.0 V
Tara de origine
Mexico
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
€ 4.060,00
€ 4,06 Buc. (Pe o rola de 1000) (fara TVA)
€ 4.912,60
€ 4,913 Buc. (Pe o rola de 1000) (cu TVA)
1000
€ 4.060,00
€ 4,06 Buc. (Pe o rola de 1000) (fara TVA)
€ 4.912,60
€ 4,913 Buc. (Pe o rola de 1000) (cu TVA)
Informatii despre stoc temporar indisponibile
1000
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
MICRO-FIT 3.0
Pitch
3.0mm
Numar contacte
18
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Surface Mount
Terminal
Solder
Material de contact
Brass
Placa contact
Tin
Curent nominal
5.0A
Dimensiune celula
43045
Tensiune
250.0 V
Tara de origine
Mexico
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.


