Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
8.5A
Numar contacte
10
Housing Material
Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Through Hole
Material de contact
Brass
Placa contact
Tin
Temperatura minima de lucru
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
105°C
Mating Pin Length
3mm
Standards/Approvals
No
Tensiune
600 V
Distrelec Product Id
304-40-672
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Informatii despre stoc temporar indisponibile
€ 6,65
€ 1,33 Buc. (Intr-un pachet de 5) (fara TVA)
€ 8,05
€ 1,609 Buc. (Intr-un pachet de 5) (cu TVA)
Standard
5
€ 6,65
€ 1,33 Buc. (Intr-un pachet de 5) (fara TVA)
€ 8,05
€ 1,609 Buc. (Intr-un pachet de 5) (cu TVA)
Informatii despre stoc temporar indisponibile
Standard
5
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 5 - 95 | € 1,33 | € 6,65 |
| 100 - 370 | € 0,93 | € 4,65 |
| 375 - 1495 | € 0,88 | € 4,40 |
| 1500+ | € 0,85 | € 4,25 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
8.5A
Numar contacte
10
Housing Material
Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Through Hole
Material de contact
Brass
Placa contact
Tin
Temperatura minima de lucru
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
105°C
Mating Pin Length
3mm
Standards/Approvals
No
Tensiune
600 V
Distrelec Product Id
304-40-672
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.


