Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Numar contacte
10
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Through Hole
Material de contact
Brass
Placa contact
Gold
Temperatura minima de lucru
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Tensiune
250 V
Distrelec Product Id
304-56-283
Tara de origine
Mexico
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
Molex Micro-Fit 3.0 Series
Informatii despre stoc temporar indisponibile
€ 12,75
€ 2,55 Buc. (Intr-un pachet de 5) (fara TVA)
€ 15,43
€ 3,086 Buc. (Intr-un pachet de 5) (cu TVA)
Standard
5
€ 12,75
€ 2,55 Buc. (Intr-un pachet de 5) (fara TVA)
€ 15,43
€ 3,086 Buc. (Intr-un pachet de 5) (cu TVA)
Informatii despre stoc temporar indisponibile
Standard
5
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 5 - 95 | € 2,55 | € 12,75 |
| 100+ | € 1,80 | € 9,00 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Numar contacte
10
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Through Hole
Material de contact
Brass
Placa contact
Gold
Temperatura minima de lucru
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Tensiune
250 V
Distrelec Product Id
304-56-283
Tara de origine
Mexico
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs


