Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 6 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Nr. stoc RS: 670-0365Producator: MolexCod de producator: 43045-0601
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Documente tehnice

Specificatii

Marca

Molex

Dimensiune celula

MICRO-FIT 3.0

Pitch

3.0mm

Numar contacte

6

Number Of Rows

2

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Montare

Through Hole

Terminal

Solder

Placa contact

Gold

Material de contact

Brass

Curent nominal

5.0A

Dimensiune celula

43045

Tensiune

250.0 V

Tara de origine

Mexico

Detalii produs

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Molex Micro-Fit 3.0 Series

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Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 2,57

Buc. (Intr-un pachet de 5) (fara TVA)

€ 3,058

Buc. (Intr-un pachet de 5) (cu TVA)

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 6 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Selectati tipul de ambalaj

€ 2,57

Buc. (Intr-un pachet de 5) (fara TVA)

€ 3,058

Buc. (Intr-un pachet de 5) (cu TVA)

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 6 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Informatii indisponibile despre stoc
Selectati tipul de ambalaj

Cumpara in pachete mari

CantitatePret unitarPer Pachet
5 - 95€ 2,57€ 12,85
100 - 370€ 1,77€ 8,85
375 - 1495€ 1,69€ 8,45
1500 - 2995€ 1,36€ 6,80
3000+€ 1,30€ 6,50

Idei. creează. Colaborează

ÎNSCRIE-TE GRATIS

Fara taxe ascunse!

design-spark
design-spark
  • Descărcați și utilizați software-ul nostru DesignSpark pentru modelele dumneavoastră PCB și mecanice 3D
  • Vizualizați și contribuiți cu conținutul site-ului web și forumuri
  • Descărcați modele 3D, scheme și amprente de la peste un milion de produse
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Documente tehnice

Specificatii

Marca

Molex

Dimensiune celula

MICRO-FIT 3.0

Pitch

3.0mm

Numar contacte

6

Number Of Rows

2

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Montare

Through Hole

Terminal

Solder

Placa contact

Gold

Material de contact

Brass

Curent nominal

5.0A

Dimensiune celula

43045

Tensiune

250.0 V

Tara de origine

Mexico

Detalii produs

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Molex Micro-Fit 3.0 Series

Idei. creează. Colaborează

ÎNSCRIE-TE GRATIS

Fara taxe ascunse!

design-spark
design-spark
  • Descărcați și utilizați software-ul nostru DesignSpark pentru modelele dumneavoastră PCB și mecanice 3D
  • Vizualizați și contribuiți cu conținutul site-ului web și forumuri
  • Descărcați modele 3D, scheme și amprente de la peste un milion de produse
Click aici pentru a afla mai multe