Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded

Nr. stoc RS: 670-0333PProducator: MolexCod de producator: 43045-0413
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Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

Molex

Serie

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

8.5A

Numar contacte

4

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Pozitionare

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Montare

Through Hole

Material de contact

Brass

Placa contact

Gold

Temperatura minima de lucru

-40°C

Row Pitch

3mm

Terminal

Solder

Contact Gender

Male

Temperatura maxima de lucru

125°C

Mating Pin Length

3mm

Standards/Approvals

No

Tensiune

600 V

Detalii produs

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Informatii despre stoc temporar indisponibile

€ 102,00

€ 1,02 Each (Supplied in a Bag) (fara TVA)

€ 123,42

€ 1,234 Each (Supplied in a Bag) (cu TVA)

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded
Selectati tipul de ambalaj

€ 102,00

€ 1,02 Each (Supplied in a Bag) (fara TVA)

€ 123,42

€ 1,234 Each (Supplied in a Bag) (cu TVA)

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded

Informatii despre stoc temporar indisponibile

Selectati tipul de ambalaj

CantitatePret unitarPer Punga
100 - 370€ 1,02€ 5,10
375 - 1495€ 0,97€ 4,85
1500 - 2995€ 0,78€ 3,90
3000+€ 0,74€ 3,70

Inspiră. Proiectează. Colaborează

ÎNSCRIE-TE GRATIS

Fara taxe ascunse!

design-spark
design-spark
  • Descărcați și utilizați software-ul nostru DesignSpark pentru modelele dumneavoastră PCB și mecanice 3D
  • Vizualizați și contribuiți cu conținutul site-ului web și forumuri
  • Descărcați modele 3D, scheme și amprente de la peste un milion de produse
Click aici pentru a afla mai multe

Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

Molex

Serie

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

8.5A

Numar contacte

4

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Pozitionare

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Montare

Through Hole

Material de contact

Brass

Placa contact

Gold

Temperatura minima de lucru

-40°C

Row Pitch

3mm

Terminal

Solder

Contact Gender

Male

Temperatura maxima de lucru

125°C

Mating Pin Length

3mm

Standards/Approvals

No

Tensiune

600 V

Detalii produs

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Inspiră. Proiectează. Colaborează

ÎNSCRIE-TE GRATIS

Fara taxe ascunse!

design-spark
design-spark
  • Descărcați și utilizați software-ul nostru DesignSpark pentru modelele dumneavoastră PCB și mecanice 3D
  • Vizualizați și contribuiți cu conținutul site-ului web și forumuri
  • Descărcați modele 3D, scheme și amprente de la peste un milion de produse
Click aici pentru a afla mai multe