Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
8.5A
Numar contacte
4
Housing Material
Thermoplastic
Number of Rows
2
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Surface
Material de contact
Brass
Placa contact
Tin
Temperatura minima de lucru
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
105°C
Mating Pin Length
3mm
Standards/Approvals
EU RoHS, Low-Halogen, REACH SVHC, UL E29179
Tensiune
600 V
Distrelec Product Id
304-42-660
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Informatii despre stoc temporar indisponibile
€ 133,00
€ 1,33 Buc. (Livrat pe rola) (fara TVA)
€ 160,93
€ 1,609 Buc. (Livrat pe rola) (cu TVA)
Impachetare pentru productie (Rola)
100
€ 133,00
€ 1,33 Buc. (Livrat pe rola) (fara TVA)
€ 160,93
€ 1,609 Buc. (Livrat pe rola) (cu TVA)
Informatii despre stoc temporar indisponibile
Impachetare pentru productie (Rola)
100
| Cantitate | Pret unitar | Per Rola |
|---|---|---|
| 100 - 370 | € 1,33 | € 6,65 |
| 375 - 1495 | € 1,27 | € 6,35 |
| 1500 - 2995 | € 1,09 | € 5,45 |
| 3000+ | € 1,03 | € 5,15 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSerie
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
8.5A
Numar contacte
4
Housing Material
Thermoplastic
Number of Rows
2
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Surface
Material de contact
Brass
Placa contact
Tin
Temperatura minima de lucru
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
105°C
Mating Pin Length
3mm
Standards/Approvals
EU RoHS, Low-Halogen, REACH SVHC, UL E29179
Tensiune
600 V
Distrelec Product Id
304-42-660
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.


