Documente tehnice
Specificatii
Marca
MolexSerie
KK 396
Pitch
3.96mm
Numar contacte
3
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Board to Board, Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Dimensiune celula
171813
Curent nominal
7.0A
Tensiune
250.0 V
Detalii produs
KK 396 Reflow Process Compatible (RCP) Friction Lock Headers
The KK 396 Reflow Process Compatible (RCP) Friction Lock Headers are designed to with stand +260° C temperatures and does not need the drying requirements of normal nylon. This range of KK 396 Reflow Process Compatible (RCP) Friction Lock Headers are Matte-tin over nickel plated which inhibits tin whiskering. A PCB thickness of 1.60 mm is recommended for these KK 396 Reflow Process Compatible (RCP) Friction Lock Headers.
3.96mm Molex KK Range
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Documente tehnice
Specificatii
Marca
MolexSerie
KK 396
Pitch
3.96mm
Numar contacte
3
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Board to Board, Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Dimensiune celula
171813
Curent nominal
7.0A
Tensiune
250.0 V
Detalii produs
KK 396 Reflow Process Compatible (RCP) Friction Lock Headers
The KK 396 Reflow Process Compatible (RCP) Friction Lock Headers are designed to with stand +260° C temperatures and does not need the drying requirements of normal nylon. This range of KK 396 Reflow Process Compatible (RCP) Friction Lock Headers are Matte-tin over nickel plated which inhibits tin whiskering. A PCB thickness of 1.60 mm is recommended for these KK 396 Reflow Process Compatible (RCP) Friction Lock Headers.