Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexNumar contacte
4
Product Type
PCB Socket
Number of Rows
2
Sub Type
Board-to-Board
Pitch
4.2mm
Current
9A
Terminal
Solder
Montare
Through Hole
Pozitionare
Straight
Connector System
Board-to-Board
Tensiune
600 V
Serie
Mini-Fit BMI
Temperatura minima de lucru
-40°C
Row Pitch
4.2mm
Contact Gender
Male
Temperatura maxima de lucru
105°C
Material de contact
Brass
Placa contact
Tin
Standards/Approvals
No
Tara de origine
United States
Detalii produs
Mini-Fit BMI Headers - 42385 Series
This Mini-Fit Series 42385 BMI vertical headers are designed for board-to-board or power applications.The Blind Mate Interface (BMI) feature allows easier alignment in panel-to-board and board-to-board applications. They are dual row with tin (Sn) plated contacts and snap-in plastic peg PCB lock.
Molex Mini-Fit BMI Series
Informatii despre stoc temporar indisponibile
€ 1,07
€ 1,07 Buc. (fara TVA)
€ 1,29
€ 1,29 Buc. (cu TVA)
1
€ 1,07
€ 1,07 Buc. (fara TVA)
€ 1,29
€ 1,29 Buc. (cu TVA)
Informatii despre stoc temporar indisponibile
1
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexNumar contacte
4
Product Type
PCB Socket
Number of Rows
2
Sub Type
Board-to-Board
Pitch
4.2mm
Current
9A
Terminal
Solder
Montare
Through Hole
Pozitionare
Straight
Connector System
Board-to-Board
Tensiune
600 V
Serie
Mini-Fit BMI
Temperatura minima de lucru
-40°C
Row Pitch
4.2mm
Contact Gender
Male
Temperatura maxima de lucru
105°C
Material de contact
Brass
Placa contact
Tin
Standards/Approvals
No
Tara de origine
United States
Detalii produs
Mini-Fit BMI Headers - 42385 Series
This Mini-Fit Series 42385 BMI vertical headers are designed for board-to-board or power applications.The Blind Mate Interface (BMI) feature allows easier alignment in panel-to-board and board-to-board applications. They are dual row with tin (Sn) plated contacts and snap-in plastic peg PCB lock.


