Laird Technologies Self-Adhesive Thermal Interface Pad, 0.25mm Thick, 5W/m·K, Boron Nitride Filled Silicone Elastomer,

Nr. stoc RS: 446-431Producator: Laird TechnologiesCod de producator: U021041-31-U1
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Documente tehnice

Specificatii

Marca

Laird Technologies

Dimensiuni

19 x 13mm

Grosime

0.25mm

Lungime

19mm

Latime

13mm

Thermal Conductivity

5W/m·K

Material

Boron Nitride Filled Silicone Elastomer

Self-Adhesive

Yes

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+200°C

Hardness

Shore A 85

Temperatura de lucru

-60 → +200 °C

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Informatii indisponibile despre stoc

P.O.A.

Laird Technologies Self-Adhesive Thermal Interface Pad, 0.25mm Thick, 5W/m·K, Boron Nitride Filled Silicone Elastomer,

10

Disponibil in multiplu de 1
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

P.O.A.

Laird Technologies Self-Adhesive Thermal Interface Pad, 0.25mm Thick, 5W/m·K, Boron Nitride Filled Silicone Elastomer,
Informatii indisponibile despre stoc

10

Disponibil in multiplu de 1
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.
S-ar putea să te intereseze

Documente tehnice

Specificatii

Marca

Laird Technologies

Dimensiuni

19 x 13mm

Grosime

0.25mm

Lungime

19mm

Latime

13mm

Thermal Conductivity

5W/m·K

Material

Boron Nitride Filled Silicone Elastomer

Self-Adhesive

Yes

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+200°C

Hardness

Shore A 85

Temperatura de lucru

-60 → +200 °C

S-ar putea să te intereseze