Documente tehnice
Specificatii
Marca
KYOCERA AVXCapacitate
22µF
Tensiune
6.3V dc
Package/Case
0805 (2012M)
Montare
Surface Mount
Dimensiuni
2.1 x 1.25 x 1.4mm
Lungime
2.1mm
Adancime
1.25mm
Inaltime
1.4mm
Temperatura maxima de lucru
+85°C
Frecventa minima de auto-rezonanta
-55°C
Tip terminal
Surface Mount
Detalii produs
AVX X5R Dielectric Capacitors
AVX X5R Series offer high capacitance values up to 100 μF and are suited for decoupling and filtering applications. Available in high capacitance values (up to 100uF)
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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100
Documente tehnice
Specificatii
Marca
KYOCERA AVXCapacitate
22µF
Tensiune
6.3V dc
Package/Case
0805 (2012M)
Montare
Surface Mount
Dimensiuni
2.1 x 1.25 x 1.4mm
Lungime
2.1mm
Adancime
1.25mm
Inaltime
1.4mm
Temperatura maxima de lucru
+85°C
Frecventa minima de auto-rezonanta
-55°C
Tip terminal
Surface Mount
Detalii produs
AVX X5R Dielectric Capacitors
AVX X5R Series offer high capacitance values up to 100 μF and are suited for decoupling and filtering applications. Available in high capacitance values (up to 100uF)
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.