Documente tehnice
Specificatii
Marca
KEMETCapacitate
100nF
Tensiune
50V dc
Package/Case
0805 (2012M)
Timp montare
Surface Mount
Dielectric
X7R
Toleranta
±5%
Dimensiuni
2 x 1.25 x 0.9mm
Lungime
2mm
Adancime
1.25mm
Inaltime
0.9mm
Serie
C
Temperatura maxima de lucru
+125°C
Temperatura minima de lucru
-55°C
Distrelec Product Id
30408793
Tara de origine
Mexico
Detalii produs
KEMET C0805 Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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€ 0,09
Buc. (Intr-un pachet de 10) (fara TVA)
€ 0,107
Buc. (Intr-un pachet de 10) (cu TVA)
Standard
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10 - 90 | € 0,09 | € 0,90 |
100 - 240 | € 0,08 | € 0,80 |
250 - 490 | € 0,07 | € 0,70 |
500 - 990 | € 0,07 | € 0,70 |
1000+ | € 0,06 | € 0,60 |
Documente tehnice
Specificatii
Marca
KEMETCapacitate
100nF
Tensiune
50V dc
Package/Case
0805 (2012M)
Timp montare
Surface Mount
Dielectric
X7R
Toleranta
±5%
Dimensiuni
2 x 1.25 x 0.9mm
Lungime
2mm
Adancime
1.25mm
Inaltime
0.9mm
Serie
C
Temperatura maxima de lucru
+125°C
Temperatura minima de lucru
-55°C
Distrelec Product Id
30408793
Tara de origine
Mexico
Detalii produs
KEMET C0805 Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.