Documente tehnice
Specificatii
Marca
InfineonNume familie
XE166
Tip pachet
LQFP
Timp montare
Surface Mount
Numar pini
100
Device Core
C166
Data Bus Width
16bit
Program Memory Size
768 kB
Frecventa maxima
80MHz
Capacitate RAM
64 kB
USB Channels
0
Typical Operating Supply Voltage
1.4 → 1.6 V
Number of ADC Units
2
Temperatura maxima de lucru
+125 °C
Lungime
14mm
ADCs
16 x 10 bit
Inaltime
1.4mm
Latime
14mm
Data Rate
1Mbps
Dimensiuni
14 x 14 x 1.4mm
Program Memory Type
Flash
Temperatura minima de lucru
-40 °C
Instruction Set Architecture
CISC, DSP, RISC
Detalii produs
C166 Family Microcontrollers, Infineon
The Infineon C166 microcontroller family are ideally suited to automotive, industrial, mass storage and wired or wireless communications applications. These microcontrollers offer better real time control performance than even 32bit, RISC processors. As a 16bit device it also offers a smaller and therefore more cost-effective footprint.
C166 Microcontrollers, Infineon
€ 15,42
€ 15,42 Buc. (fara TVA)
€ 18,35
€ 18,35 Buc. (cu TVA)
Standard
1
€ 15,42
€ 15,42 Buc. (fara TVA)
€ 18,35
€ 18,35 Buc. (cu TVA)
Standard
1
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Documente tehnice
Specificatii
Marca
InfineonNume familie
XE166
Tip pachet
LQFP
Timp montare
Surface Mount
Numar pini
100
Device Core
C166
Data Bus Width
16bit
Program Memory Size
768 kB
Frecventa maxima
80MHz
Capacitate RAM
64 kB
USB Channels
0
Typical Operating Supply Voltage
1.4 → 1.6 V
Number of ADC Units
2
Temperatura maxima de lucru
+125 °C
Lungime
14mm
ADCs
16 x 10 bit
Inaltime
1.4mm
Latime
14mm
Data Rate
1Mbps
Dimensiuni
14 x 14 x 1.4mm
Program Memory Type
Flash
Temperatura minima de lucru
-40 °C
Instruction Set Architecture
CISC, DSP, RISC
Detalii produs
C166 Family Microcontrollers, Infineon
The Infineon C166 microcontroller family are ideally suited to automotive, industrial, mass storage and wired or wireless communications applications. These microcontrollers offer better real time control performance than even 32bit, RISC processors. As a 16bit device it also offers a smaller and therefore more cost-effective footprint.