HARWIN 3.5mm Grounding Contact

Nr. stoc RS: 173-0842Producator: HARWINCod de producator: S1761-46R
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Specificatii

Marca

HARWIN

Dimensiune celula

EZ-BoardWare

Material

Titanium Copper Alloy

Curent nominal

4A

Metoda fixare

Surface Mount

Placa contact

Tin over Nickel

Dimensiuni

4.5 x 2.5 x 3.5mm

Inaltime

3.5mm

Lungime

4.5mm

Latime

2.5mm

Tara de origine

China

Detalii produs

Harwin EZ Boardware SMT RFI/Grounding Spring Contacts

EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

P.O.A.

HARWIN 3.5mm Grounding Contact

2000

Disponibil in multiplu de 2000
2000P.O.A.
4000P.O.A.
6000P.O.A.
8000P.O.A.
10000P.O.A.
12000P.O.A.
14000P.O.A.
16000P.O.A.
18000P.O.A.
20000P.O.A.
22000P.O.A.
24000P.O.A.
26000P.O.A.
28000P.O.A.
30000P.O.A.

P.O.A.

HARWIN 3.5mm Grounding Contact
Informatii indisponibile despre stoc

2000

Disponibil in multiplu de 2000
2000P.O.A.
4000P.O.A.
6000P.O.A.
8000P.O.A.
10000P.O.A.
12000P.O.A.
14000P.O.A.
16000P.O.A.
18000P.O.A.
20000P.O.A.
22000P.O.A.
24000P.O.A.
26000P.O.A.
28000P.O.A.
30000P.O.A.

Documente tehnice

Specificatii

Marca

HARWIN

Dimensiune celula

EZ-BoardWare

Material

Titanium Copper Alloy

Curent nominal

4A

Metoda fixare

Surface Mount

Placa contact

Tin over Nickel

Dimensiuni

4.5 x 2.5 x 3.5mm

Inaltime

3.5mm

Lungime

4.5mm

Latime

2.5mm

Tara de origine

China

Detalii produs

Harwin EZ Boardware SMT RFI/Grounding Spring Contacts

EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.