EPCOS 150pF MLCC, 50V dc V, ±5% , SMD
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
EpcosCapacitate
150pF
Tensiune
50V dc
Package/Case
2012
Montare
Surface Mount
Dielectric
C0G
Toleranta
±5%
Dimensiuni
2 x 1.25 x 1.3mm
Lungime
2mm
Adancime
1.25mm
Inaltime
1.3mm
Temperatura maxima de lucru
+125°C
Frecventa minima de auto-rezonanta
-55°C
Tip terminal
Surface Mount
Detalii produs
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
P.O.A.
Buc. (Intr-un pachet de 50) (fara TVA)
Standard
50
P.O.A.
Buc. (Intr-un pachet de 50) (fara TVA)
Informatii despre stoc temporar indisponibile
Standard
50
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
EpcosCapacitate
150pF
Tensiune
50V dc
Package/Case
2012
Montare
Surface Mount
Dielectric
C0G
Toleranta
±5%
Dimensiuni
2 x 1.25 x 1.3mm
Lungime
2mm
Adancime
1.25mm
Inaltime
1.3mm
Temperatura maxima de lucru
+125°C
Frecventa minima de auto-rezonanta
-55°C
Tip terminal
Surface Mount
Detalii produs
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.