Bourns CR1206 0Ω, 1206 (3216M) Thick Film SMD Resistor ±5% 0.25W

Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
BournsRezistenta
0Ω
Tehnologie
Thick Film
Package/Case
1206 (3216M)
Toleranta
±5%
Putere
0.25W
Coeficient temperatura
-250 → +500ppm/°C
Serie
CR1206
Temperatura minima de lucru
-55°C
Temperatura maxima de lucru
+155°C
Tara de origine
Taiwan, Province Of China
Detalii produs
1206 Format Resistor, CR1206-JW Series - 5%
The CR1206 series of thick film surface mount resistors from Bourns feature a power rating of 0.1W at 70°C. Constructed from three layers, these chip resistors feature a nickel barrier that prevents leaching and ensures excellent solderability, allowing for all types of soldering processes to be used.
€ 1,00
€ 0,02 Buc. (Intr-un pachet de 50) (fara TVA)
€ 1,21
€ 0,024 Buc. (Intr-un pachet de 50) (cu TVA)
Standard
50
€ 1,00
€ 0,02 Buc. (Intr-un pachet de 50) (fara TVA)
€ 1,21
€ 0,024 Buc. (Intr-un pachet de 50) (cu TVA)
Informatii despre stoc temporar indisponibile
Standard
50
Informatii despre stoc temporar indisponibile
Cantitate | Pret unitar | Per Pachet |
---|---|---|
50 - 450 | € 0,02 | € 1,00 |
500 - 950 | € 0,02 | € 1,00 |
1000 - 1950 | € 0,02 | € 1,00 |
2000 - 3950 | € 0,02 | € 1,00 |
4000+ | € 0,02 | € 1,00 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
BournsRezistenta
0Ω
Tehnologie
Thick Film
Package/Case
1206 (3216M)
Toleranta
±5%
Putere
0.25W
Coeficient temperatura
-250 → +500ppm/°C
Serie
CR1206
Temperatura minima de lucru
-55°C
Temperatura maxima de lucru
+155°C
Tara de origine
Taiwan, Province Of China
Detalii produs
1206 Format Resistor, CR1206-JW Series - 5%
The CR1206 series of thick film surface mount resistors from Bourns feature a power rating of 0.1W at 70°C. Constructed from three layers, these chip resistors feature a nickel barrier that prevents leaching and ensures excellent solderability, allowing for all types of soldering processes to be used.