Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

Name: Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm
Brand: Bergquist
SKU: 7073355
Availability: LimitedAvailability

Nr. stoc RS: 707-3355Producator: BergquistCod de producator: SPK6-0.006-00-54

Vezi toate produsele din Placute de transfer termic

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

19.05 x 12.7mm

Grosime

0.152mm

Lungime

19.05mm

Latime

12.7mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K6

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil Pad® K6

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 0,49

Buc. (Intr-un pachet de 10) (fara TVA)

€ 0,583

Buc. (Intr-un pachet de 10) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

€ 0,49

Buc. (Intr-un pachet de 10) (fara TVA)

€ 0,583

Buc. (Intr-un pachet de 10) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

Informatii indisponibile despre stoc

Cumpara in pachete mari

Cantitate	Pret unitar	Per Pachet
10 - 40	€ 0,49	€ 4,90
50 - 240	€ 0,43	€ 4,30
250 - 490	€ 0,39	€ 3,90
500 - 990	€ 0,36	€ 3,60
1000+	€ 0,34	€ 3,40

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

19.05 x 12.7mm

Grosime

0.152mm

Lungime

19.05mm

Latime

12.7mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K6

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs