Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

Nr. stoc RS: 707-3364Producator: BergquistCod de producator: SPK6-0.006-00-104
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Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19.05mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19.05mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K6

Temperatura de lucru

-60 → +180 °C

Detalii produs

Sil Pad® K6

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 0,89

Buc. (Intr-un pachet de 10) (fara TVA)

€ 1,059

Buc. (Intr-un pachet de 10) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

10

Disponibil in multiplu de 10
10€ 8,90
20€ 17,80
30€ 26,70
40€ 35,60
50€ 44,50
60€ 53,40
70€ 62,30
80€ 71,20
90€ 80,10
100€ 89,00
110€ 97,90
120€ 106,80
130€ 115,70
140€ 124,60
150€ 133,50

€ 0,89

Buc. (Intr-un pachet de 10) (fara TVA)

€ 1,059

Buc. (Intr-un pachet de 10) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm
Informatii indisponibile despre stoc

10

Disponibil in multiplu de 10
10€ 8,90
20€ 17,80
30€ 26,70
40€ 35,60
50€ 44,50
60€ 53,40
70€ 62,30
80€ 71,20
90€ 80,10
100€ 89,00
110€ 97,90
120€ 106,80
130€ 115,70
140€ 124,60
150€ 133,50

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19.05mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19.05mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K6

Temperatura de lucru

-60 → +180 °C

Detalii produs

Sil Pad® K6