Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm

Nr. stoc RS: 169-4577Producator: BergquistCod de producator: SPK4-0.006-AC-104
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Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Self-Adhesive

Yes

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K4 insulators

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Informatii indisponibile despre stoc

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Informatii indisponibile despre stoc

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm

50

Disponibil in multiplu de 1
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm
Informatii indisponibile despre stoc

50

Disponibil in multiplu de 1
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.
S-ar putea să te intereseze

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Self-Adhesive

Yes

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K4 insulators

S-ar putea să te intereseze