Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

Name: Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm
Brand: Bergquist
SKU: 1694498
Availability: LimitedAvailability

Nr. stoc RS: 169-4498Producator: BergquistCod de producator: SPK4-0.006-00-54

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Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

19.05 x 12.7mm

Grosime

0.152mm

Lungime

19.05mm

Latime

12.7mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K4 insulators

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 0,40

Buc. (Intr-un pachet de 50) (fara TVA)

€ 0,476

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

€ 0,40

Buc. (Intr-un pachet de 50) (fara TVA)

€ 0,476

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

Informatii indisponibile despre stoc

Cumpara in pachete mari

Cantitate	Pret unitar	Per Pachet
50 - 550	€ 0,40	€ 20,00
600 - 1200	€ 0,37	€ 18,50
1250 - 2450	€ 0,36	€ 18,00
2500 - 4950	€ 0,34	€ 17,00
5000+	€ 0,33	€ 16,50

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

19.05 x 12.7mm

Grosime

0.152mm

Lungime

19.05mm

Latime

12.7mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs