Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 28.96 x 20.57mm

Name: Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 28.96 x 20.57mm
Brand: Bergquist
SKU: 2833688
Availability: LimitedAvailability

Nr. stoc RS: 283-3688Producator: BergquistCod de producator: SPK4-0.006-00-122

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Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

28.96 x 20.57mm

Grosime

0.152mm

Lungime

28.96mm

Latime

20.57mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K4 insulators

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 1,12

Buc. (Intr-un pachet de 50) (fara TVA)

€ 1,333

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 28.96 x 20.57mm

€ 1,12

Buc. (Intr-un pachet de 50) (fara TVA)

€ 1,333

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 28.96 x 20.57mm

Informatii indisponibile despre stoc

Cumpara in pachete mari

Cantitate	Pret unitar	Per Pachet
50 - 200	€ 1,12	€ 56,00
250 - 1200	€ 1,04	€ 52,00
1250 - 2450	€ 1,00	€ 50,00
2500 - 4950	€ 0,96	€ 48,00
5000+	€ 0,92	€ 46,00

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

28.96 x 20.57mm

Grosime

0.152mm

Lungime

28.96mm

Latime

20.57mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs