Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm

Nr. stoc RS: 169-4533Producator: BergquistCod de producator: SPK4-0.006-00-104
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Documente tehnice

Specificatii

Dimensiuni

25.4 x 19mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K4 insulators

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 0,53

Buc. (Intr-un pachet de 50) (fara TVA)

€ 0,631

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm

€ 0,53

Buc. (Intr-un pachet de 50) (fara TVA)

€ 0,631

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm
Informatii indisponibile despre stoc

Cumpara in pachete mari

CantitatePret unitarPer Pachet
50 - 450€ 0,53€ 26,50
500 - 2450€ 0,49€ 24,50
2500+€ 0,47€ 23,50

Documente tehnice

Specificatii

Dimensiuni

25.4 x 19mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K4 insulators