Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 28.96 x 20.57mm
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
28.96 x 20.57mm
Grosime
0.152mm
Lungime
28.96mm
Latime
20.57mm
Thermal Conductivity
1.3W/m·K
Material
Thin Film Polyimide
Self-Adhesive
Yes
Temperatura minima de lucru
-60°C
Temperatura maxima de lucru
+180°C
Hardness
Shore A 90
Material
Sil-Pad K10
Temperatura de lucru
-60 → +180 °C
Tara de origine
United States
Detalii produs
Sil-Pad K10 insulators
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 3,33
Buc. (Intr-un pachet de 10) (fara TVA)
€ 3,963
Buc. (Intr-un pachet de 10) (cu TVA)
10
€ 3,33
Buc. (Intr-un pachet de 10) (fara TVA)
€ 3,963
Buc. (Intr-un pachet de 10) (cu TVA)
10
Cumpara in pachete mari
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 10 - 90 | € 3,33 | € 33,30 |
| 100 - 490 | € 2,88 | € 28,80 |
| 500+ | € 2,54 | € 25,40 |
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
28.96 x 20.57mm
Grosime
0.152mm
Lungime
28.96mm
Latime
20.57mm
Thermal Conductivity
1.3W/m·K
Material
Thin Film Polyimide
Self-Adhesive
Yes
Temperatura minima de lucru
-60°C
Temperatura maxima de lucru
+180°C
Hardness
Shore A 90
Material
Sil-Pad K10
Temperatura de lucru
-60 → +180 °C
Tara de origine
United States
Detalii produs
Sil-Pad K10 insulators