Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 41.91 x 28.96mm

Nr. stoc RS: 169-4599Producator: BergquistCod de producator: SPK10-0.006-00-05
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Specificatii

Marca

Bergquist

Dimensiuni

41.91 x 28.96mm

Grosime

0.152mm

Lungime

41.91mm

Latime

28.96mm

Thermal Conductivity

1.3W/m·K

Material

Thin Film Polyimide

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K10

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K10 insulators

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Informatii indisponibile despre stoc

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Informatii indisponibile despre stoc

P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 41.91 x 28.96mm

10

Disponibil in multiplu de 1
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 41.91 x 28.96mm
Informatii indisponibile despre stoc

10

Disponibil in multiplu de 1
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.
S-ar putea să te intereseze

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

41.91 x 28.96mm

Grosime

0.152mm

Lungime

41.91mm

Latime

28.96mm

Thermal Conductivity

1.3W/m·K

Material

Thin Film Polyimide

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K10

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K10 insulators

S-ar putea să te intereseze