Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 41.91 x 28.96mm

Nr. stoc RS: 169-4599Producator: BergquistCod de producator: SPK10-0.006-00-05
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Specificatii

Marca

Bergquist

Dimensiuni

41.91 x 28.96mm

Grosime

0.152mm

Lungime

41.91mm

Latime

28.96mm

Thermal Conductivity

1.3W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K10

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K10 insulators

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 41.91 x 28.96mm

10

Disponibil in multiplu de 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 41.91 x 28.96mm
Informatii indisponibile despre stoc

10

Disponibil in multiplu de 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

41.91 x 28.96mm

Grosime

0.152mm

Lungime

41.91mm

Latime

28.96mm

Thermal Conductivity

1.3W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K10

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K10 insulators