Bergquist Thermal Interface Pad, 0.178mm Thick, 0.9W/m·K, Fibreglass, 28.96 x 20.57mm

Nr. stoc RS: 283-3638Producator: BergquistCod de producator: SP400-0.007-00-122
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Specificatii

Dimensiuni

28.96 x 20.57mm

Grosime

0.178mm

Lungime

28.96mm

Latime

20.57mm

Thermal Conductivity

0.9W/m·K

Material

Fibreglass

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 85

Material

Sil-Pad 400

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad 400 Insulators

Informatii indisponibile despre stoc

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P.O.A.

Bergquist Thermal Interface Pad, 0.178mm Thick, 0.9W/m·K, Fibreglass, 28.96 x 20.57mm

P.O.A.

Bergquist Thermal Interface Pad, 0.178mm Thick, 0.9W/m·K, Fibreglass, 28.96 x 20.57mm
Informatii indisponibile despre stoc

Documente tehnice

Specificatii

Dimensiuni

28.96 x 20.57mm

Grosime

0.178mm

Lungime

28.96mm

Latime

20.57mm

Thermal Conductivity

0.9W/m·K

Material

Fibreglass

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 85

Material

Sil-Pad 400

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad 400 Insulators