Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 11.1 x 7.92mm

Nr. stoc RS: 169-2379Producator: BergquistCod de producator: SP2000-0.015-00-50
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Specificatii

Marca

Bergquist

Dimensiuni

11.1 x 7.92mm

Grosime

0.015in

Lungime

11.1mm

Latime

7.92mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+200°C

Hardness

Shore A 90

Material

Sil-Pad 2000

Temperatura de lucru

-60 → +200 °C

Tara de origine

United States

Detalii produs

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.

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P.O.A.

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 11.1 x 7.92mm

10

Disponibil in multiplu de 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

P.O.A.

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 11.1 x 7.92mm
Informatii indisponibile despre stoc

10

Disponibil in multiplu de 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

11.1 x 7.92mm

Grosime

0.015in

Lungime

11.1mm

Latime

7.92mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+200°C

Hardness

Shore A 90

Material

Sil-Pad 2000

Temperatura de lucru

-60 → +200 °C

Tara de origine

United States

Detalii produs

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.