Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass

Nr. stoc RS: 169-2420Producator: BergquistCod de producator: SP2000-0.015-00-21
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Specificatii

Marca

Bergquist

Grosime

0.015in

Diametru

20.32mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+200°C

Hardness

Shore A 90

Material

Sil-Pad 2000

Temperatura de lucru

-60 → +200 °C

Tara de origine

United States

Detalii produs

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.

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Informatii indisponibile despre stoc

P.O.A.

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass

10

Disponibil in multiplu de 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

P.O.A.

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass
Informatii indisponibile despre stoc

10

Disponibil in multiplu de 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

Documente tehnice

Specificatii

Marca

Bergquist

Grosime

0.015in

Diametru

20.32mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+200°C

Hardness

Shore A 90

Material

Sil-Pad 2000

Temperatura de lucru

-60 → +200 °C

Tara de origine

United States

Detalii produs

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.