Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
BergquistDimensiuni
25.4 x 19.05mm
Grosime
0.015in
Lungime
25.4mm
Latime
19.05mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Frecventa minima de auto-rezonanta
-60°C
Temperatura maxima de lucru
+200°C
Hardness
Shore A 90
Material
Sil-Pad 2000
Temperatura de lucru
-60 → +200 °C
Tara de origine
United States
Detalii produs
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
€ 22,90
€ 2,29 Buc. (Intr-un pachet de 10) (fara TVA)
€ 27,71
€ 2,771 Buc. (Intr-un pachet de 10) (cu TVA)
10
€ 22,90
€ 2,29 Buc. (Intr-un pachet de 10) (fara TVA)
€ 27,71
€ 2,771 Buc. (Intr-un pachet de 10) (cu TVA)
Informatii despre stoc temporar indisponibile
10
Informatii despre stoc temporar indisponibile
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 10 - 40 | € 2,29 | € 22,90 |
| 50 - 190 | € 2,04 | € 20,40 |
| 200 - 490 | € 1,92 | € 19,20 |
| 500 - 990 | € 1,85 | € 18,50 |
| 1000+ | € 1,78 | € 17,80 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
BergquistDimensiuni
25.4 x 19.05mm
Grosime
0.015in
Lungime
25.4mm
Latime
19.05mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Frecventa minima de auto-rezonanta
-60°C
Temperatura maxima de lucru
+200°C
Hardness
Shore A 90
Material
Sil-Pad 2000
Temperatura de lucru
-60 → +200 °C
Tara de origine
United States
Detalii produs
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
