Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 19.05 x 12.7mm
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
BergquistDimensiuni
19.05 x 12.7mm
Grosime
0.015in
Lungime
19.05mm
Latime
12.7mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Frecventa minima de auto-rezonanta
-60°C
Temperatura maxima de lucru
+200°C
Hardness
Shore A 90
Material
Sil-Pad 2000
Temperatura de lucru
-60 → +200 °C
Tara de origine
United States
Detalii produs
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
€ 13,10
€ 1,31 Buc. (Intr-un pachet de 10) (fara TVA)
€ 15,85
€ 1,585 Buc. (Intr-un pachet de 10) (cu TVA)
10
€ 13,10
€ 1,31 Buc. (Intr-un pachet de 10) (fara TVA)
€ 15,85
€ 1,585 Buc. (Intr-un pachet de 10) (cu TVA)
Informatii despre stoc temporar indisponibile
10
Informatii despre stoc temporar indisponibile
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 10 - 90 | € 1,31 | € 13,10 |
| 100 - 490 | € 1,26 | € 12,60 |
| 500+ | € 1,22 | € 12,20 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
BergquistDimensiuni
19.05 x 12.7mm
Grosime
0.015in
Lungime
19.05mm
Latime
12.7mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Frecventa minima de auto-rezonanta
-60°C
Temperatura maxima de lucru
+200°C
Hardness
Shore A 90
Material
Sil-Pad 2000
Temperatura de lucru
-60 → +200 °C
Tara de origine
United States
Detalii produs
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.