Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 25.4 x 19mm

Nr. stoc RS: 169-2127Producator: BergquistCod de producator: QII-0.006-AC-104
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Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19mm

Thermal Conductivity

2.5W/m·K

Material

Q-Pad II

Self-Adhesive

Yes

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 93

Material

Q-Pad II

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Q-Pad II insulators

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 25.4 x 19mm

50

Disponibil in multiplu de 50
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 25.4 x 19mm
Informatii indisponibile despre stoc

50

Disponibil in multiplu de 50
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19mm

Thermal Conductivity

2.5W/m·K

Material

Q-Pad II

Self-Adhesive

Yes

Temperatura minima de lucru

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 93

Material

Q-Pad II

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Q-Pad II insulators