Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 28.96 x 20.57mm

Nr. stoc RS: 283-3650Producator: BergquistCod de producator: QII-0.006-00-122
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Specificatii

Dimensiuni

28.96 x 20.57mm

Grosime

0.152mm

Lungime

28.96mm

Latime

20.57mm

Thermal Conductivity

2.5W/m·K

Material

Q-Pad II

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 93

Material

Q-Pad II

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Q-Pad II insulators

Informatii indisponibile despre stoc

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Informatii indisponibile despre stoc

P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 28.96 x 20.57mm

P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 28.96 x 20.57mm
Informatii indisponibile despre stoc

Documente tehnice

Specificatii

Dimensiuni

28.96 x 20.57mm

Grosime

0.152mm

Lungime

28.96mm

Latime

20.57mm

Thermal Conductivity

2.5W/m·K

Material

Q-Pad II

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 93

Material

Q-Pad II

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Q-Pad II insulators