Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

Nr. stoc RS: 752-4897Producator: BergquistCod de producator: HF650P-0.001-01-00-43
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Documente tehnice

Specificatii

Grosime

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Temperatura minima de lucru

-40°C

Temperatura maxima de lucru

+150°C

Material

Hi-Flow 650P

Temperatura de lucru

-40 → +150 °C

PRICED TO CLEAR

Yes

Tara de origine

United States

Detalii produs

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

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P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Informatii indisponibile despre stoc

Documente tehnice

Specificatii

Grosime

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Temperatura minima de lucru

-40°C

Temperatura maxima de lucru

+150°C

Material

Hi-Flow 650P

Temperatura de lucru

-40 → +150 °C

PRICED TO CLEAR

Yes

Tara de origine

United States

Detalii produs

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.